1 a.dunfey 1.1 // ===================================================================
2 // Title: Physical_Component
3 // $State: Exp $
4 // $Date: 2004/11/30 19:40:22 $
5 // $RCSfile: Physical_Component.mof,v $
6 // $Revision: 1.6.2.4 $
7 // ===================================================================
8 //#pragma inLine ("Includes/copyright.inc")
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43 a.dunfey 1.1 // http://www.dmtf.org/about/policies/disclosures.php.
44 //#pragma inLine
45 // ===================================================================
46 // Description: The Physical Model defines modeling concepts related
47 // to actual boxes and packaging. This file defines
48 // the concepts related to components and chips.
49 //
50 // The object classes below are listed in an order that
51 // avoids forward references. Required objects, defined
52 // by other working groups, are omitted.
53 // ==================================================================
54 // Change Log for 2.9Final
55 // CR1263 - Add DDR2 enumeration to CIM and SMBIOS
56 //
57 // Change Log for v2.8 Preliminary
58 // CR1005 - Deprecate several boolean properties in the physical model
59 // that overlap. Create a new property to express their
60 // meaning.
61 // CR1019 - CIM Versioning for 2.8 Preliminary
62 //
63 // Change Log for v2.7
64 a.dunfey 1.1 // CR623 - Fix the DMI mapping string to include the attribute number
65 // PhysicalMemory.FormFactor, .MemoryType, .TotalWidth,
66 // .DataWidth, .Speed, .Capacity, .BankLabel.
67 // ==================================================================
68
69 #pragma locale ("en_US")
70
71
72 // ==================================================================
73 // PhysicalComponent
74 // ==================================================================
75 [Version ( "2.8.0" ), Description (
76 "The PhysicalComponent class represents any low-level or basic "
77 "Component within a Package. A Component object either can not "
78 "or does not need to be decomposed into its constituent parts. "
79 "For example, an ASIC (or Chip) can not be further decomposed. "
80 "A tape for data storage (PhysicalMedia) does not need to be "
81 "decomposed. Any PhysicalElement that is not a Link, Connector, "
82 "or Package is a descendent (or member) of this class. For "
83 "example, the UART chipset on an internal modem Card would be a "
84 "subclass (if additional properties or associations are "
85 a.dunfey 1.1 "defined) or an instance of PhysicalComponent.")]
86 class CIM_PhysicalComponent : CIM_PhysicalElement {
87
88 [Description (
89 "The RemovalCapabilites property is used to describe the "
90 "conditions under which a PhysicalPackage can be removed. "
91 "Since all PhysicalPackages are not removable, this property "
92 "defaults to 2, 'Not Applicable'."),
93 ValueMap { "0", "2", "3", "4" },
94 Values { "Unknown", "Not Applicable", "Removable when off",
95 "Removable when on or off" }]
96 uint16 RemovalConditions = 2;
97
98 [Deprecated { "CIM_PhysicalComponent.RemovalConditions" },
99 Description (
100 "The use of this property is being deprecated. Instead "
101 "RemovalConditions should be used. The RemovalConditions "
102 "property addresses whether a PhysicalComponent is removable "
103 "with or without power being applied. \n"
104 "\n"
105 "A PhysicalComponent is Removable if it is designed to be "
106 a.dunfey 1.1 "taken in and out of the physical container in which it is "
107 "normally found, without impairing the function of the "
108 "overall packaging. A Component can still be Removable if "
109 "power must be 'off' in order to perform the removal. If "
110 "power can be 'on' and the Component removed, then the "
111 "Element is both Removable and HotSwappable. For example, an "
112 "upgradeable Processor chip is Removable.")]
113 boolean Removable;
114
115 [Deprecated { "No Value" }, Description (
116 "The use of this property is being deprecated because it is "
117 "redundant with the FRU class and its associations. A "
118 "PhysicalComponent is Replaceable if it is possible to "
119 "replace (FRU or upgrade) the Element with a physically "
120 "different one. For example, some ComputerSystems allow the "
121 "main Processor chip to be upgraded to one of a higher clock "
122 "rating. In this case, the Processor is said to be "
123 "Replaceable. All Removable Components are inherently "
124 "Replaceable.")]
125 boolean Replaceable;
126
127 a.dunfey 1.1 [Deprecated { "CIM_PhysicalComponent.RemovalConditions" },
128 Description (
129 "The use of this property is being deprecated. Instead "
130 "RemovalConditions should be used. The RemovalConditions "
131 "property addresses whether a PhysicalComponent is removable "
132 "with or without power being applied. \n"
133 "\n"
134 "A PhysicalComponent is HotSwappable if it is possible to "
135 "replace the Element with a physically different but "
136 "equivalent one while the containing Package has power "
137 "applied to it (ie, is 'on'). For example, a fan Component "
138 "may be designed to be HotSwappable. All HotSwappable "
139 "Components are inherently Removable and Replaceable.")]
140 boolean HotSwappable;
141 };
142
143
144 // ==================================================================
145 // PackagedComponent
146 // ==================================================================
147 [Association, Aggregation, Version ( "2.6.0" ), Description (
148 a.dunfey 1.1 "A Component is typically contained by a PhysicalPackage, such "
149 "as a Chassis or Card. The PackagedComponent association makes "
150 "this relationship explicit. In the first sentence, the word, "
151 "'typically', is used. This is because a Component may be "
152 "removed from, or not yet inserted into, its containing Package "
153 "(ie, the Removable boolean is TRUE). Therefore, a Component "
154 "may not always be associated with a container.")]
155 class CIM_PackagedComponent : CIM_Container {
156
157 [Aggregate, Override ( "GroupComponent" ), Max ( 1 ),
158 Description (
159 "The PhysicalPackage that contains Component(s).")]
160 CIM_PhysicalPackage REF GroupComponent;
161
162 [Override ( "PartComponent" ), Description (
163 "The PhysicalComponent which is contained in the Package.")]
164 CIM_PhysicalComponent REF PartComponent;
165 };
166
167
168 // ==================================================================
169 a.dunfey 1.1 // Chip
170 // ==================================================================
171 [Version ( "2.6.0" ), Description (
172 "The Chip class represents any type of integrated circuit "
173 "hardware, including ASICs, processors, memory chips, etc.")]
174 class CIM_Chip : CIM_PhysicalComponent {
175
176 [Description (
177 "The implementation form factor for the Chip. For example, "
178 "values such as SIMM (7), TSOP (9) or PGA (10) can be "
179 "specified."),
180 ValueMap { "0", "1", "2", "3", "4", "5", "6", "7", "8", "9",
181 "10", "11", "12", "13", "14", "15", "16", "17", "18", "19",
182 "20", "21", "22", "23" },
183 Values { "Unknown", "Other", "SIP", "DIP", "ZIP", "SOJ",
184 "Proprietary", "SIMM", "DIMM", "TSOP",
185 // 10
186 "PGA", "RIMM", "SODIMM", "SRIMM", "SMD", "SSMP", "QFP",
187 "TQFP", "SOIC", "LCC",
188 // 20
189 "PLCC", "BGA", "FPBGA", "LGA" }]
190 a.dunfey 1.1 uint16 FormFactor;
191 };
192
193
194 // ==================================================================
195 // PhysicalMemory
196 // ==================================================================
197 [Version ( "2.9.0" ), Description (
198 "PhysicalMemory is a subclass of CIM_Chip, representing low "
199 "level memory devices - SIMMS, DIMMs, raw memory chips, etc.")]
200 class CIM_PhysicalMemory : CIM_Chip {
201
202 [Override ( "FormFactor" ),
203 MappingStrings { "MIF.DMTF|Memory Device|005.6" }]
204 uint16 FormFactor;
205
206 [Description (
207 "The type of PhysicalMemory."),
208 ValueMap { "0", "1", "2", "3", "4", "5", "6", "7", "8", "9",
209 "10", "11", "12", "13", "14", "15", "16", "17", "18", "19",
210 "20", "21" },
211 a.dunfey 1.1 Values { "Unknown", "Other", "DRAM", "Synchronous DRAM",
212 "Cache DRAM", "EDO", "EDRAM", "VRAM", "SRAM", "RAM",
213 //10
214 "ROM", "Flash", "EEPROM", "FEPROM", "EPROM", "CDRAM",
215 "3DRAM", "SDRAM", "SGRAM", "RDRAM",
216 // 20
217 "DDR", "DDR2" },
218 MappingStrings { "MIF.DMTF|Memory Device|005.9" }]
219 uint16 MemoryType;
220
221 [Description (
222 "Total width, in bits, of the PhysicalMemory, including "
223 "check or error correction bits. If there are no error "
224 "correction bits, the value in this property should match "
225 "that specified for DataWidth."),
226 Units ( "Bits" ),
227 MappingStrings { "MIF.DMTF|Memory Device|005.7" }]
228 uint16 TotalWidth;
229
230 [Description (
231 "Data width of the PhysicalMemory, in bits. A data width of "
232 a.dunfey 1.1 "0 and a TotalWidth of 8 would indicate that the Memory is "
233 "solely used to provide error correction bits."),
234 Units ( "Bits" ),
235 MappingStrings { "MIF.DMTF|Memory Device|005.8" }]
236 uint16 DataWidth;
237
238 [Description (
239 "The speed of the PhysicalMemory, in nanoseconds."),
240 Units ( "NanoSeconds" ),
241 MappingStrings { "MIF.DMTF|Memory Device|005.24" }]
242 uint32 Speed;
243
244 [Description (
245 "The total capacity of this PhysicalMemory, in bytes."),
246 Units ( "Bytes" ),
247 MappingStrings { "MIF.DMTF|Memory Device|005.5" }]
248 uint64 Capacity;
249
250 [Description (
251 "A string identifying the physically labeled bank where the "
252 "Memory is located - for example, 'Bank 0' or 'Bank A'."),
253 a.dunfey 1.1 MaxLen ( 64 ),
254 MappingStrings { "MIF.DMTF|Memory Device|005.4" }]
255 string BankLabel;
256
257 [Description (
258 "Specifies the position of the PhysicalMemory in a 'row'. "
259 "For example, if it takes two 8-bit memory devices to form a "
260 "16- bit row, then a value of '2'means that this Memory is "
261 "the second device. 0 is an invalid value for this property."),
262 MappingStrings { "MIF.DMTF|Memory Device Mapped Addresses|001.6"
263 }]
264 uint32 PositionInRow;
265
266 [Description (
267 "The position of this PhysicalMemory in an interleave. 0 "
268 "indicates non-interleaved. 1 indicates the first position, "
269 "2 the second position and so on. For example, in a 2:1 "
270 "interleave, a value of '1' would indicate that the Memory "
271 "is in the 'even' position."),
272 MappingStrings { "MIF.DMTF|Memory Device Mapped Addresses|001.7"
273 }]
274 a.dunfey 1.1 uint32 InterleavePosition;
275 };
276
277
278 // ==================================================================
279 // MemoryOnCard
280 // ==================================================================
281 [Association, Aggregation, Version ( "2.6.0" ), Description (
282 "PhysicalMemory can be located on HostingBoards, adapter Cards, "
283 "etc. This association explicitly defines this relationship of "
284 "Memory to Cards.")]
285 class CIM_MemoryOnCard : CIM_PackagedComponent {
286
287 [Aggregate, Override ( "GroupComponent" ), Max ( 1 ),
288 Description (
289 "The Card that includes or 'contains' Memory.")]
290 CIM_Card REF GroupComponent;
291
292 [Override ( "PartComponent" ), Description (
293 "The PhysicalMemory which is located on the Card.")]
294 CIM_PhysicalMemory REF PartComponent;
295 a.dunfey 1.1 };
296
297
298 // ===================================================================
299 // end of file
300 // ===================================================================
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