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  1 a.dunfey 1.1 // ===================================================================
  2              // Title: Physical_Component
  3              // $State: Exp $
  4              // $Date: 2004/11/30 19:40:22 $
  5              // $RCSfile: Physical_Component.mof,v $
  6              // $Revision: 1.6.2.4 $
  7              // ===================================================================
  8              //#pragma inLine ("Includes/copyright.inc")
  9              // Copyright 1998-2005 Distributed Management Task Force, Inc. (DMTF).
 10              // All rights reserved.
 11              // DMTF is a not-for-profit association of industry members dedicated
 12              // to promoting enterprise and systems management and interoperability.
 13              // DMTF specifications and documents may be reproduced for uses
 14              // consistent with this purpose by members and non-members,
 15              // provided that correct attribution is given.
 16              // As DMTF specifications may be revised from time to time,
 17              // the particular version and release date should always be noted.
 18              // 
 19              // Implementation of certain elements of this standard or proposed
 20              // standard may be subject to third party patent rights, including
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 22 a.dunfey 1.1 // no representations to users of the standard as to the existence
 23              // of such rights, and is not responsible to recognize, disclose, or
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 25              // claimants, nor for any incomplete or inaccurate identification or
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 40              // For information about patents held by third-parties which have
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 43 a.dunfey 1.1 // http://www.dmtf.org/about/policies/disclosures.php.
 44              //#pragma inLine
 45              // ===================================================================
 46              // Description: The Physical Model defines modeling concepts related
 47              //              to actual boxes and packaging. This file defines
 48              //              the concepts related to components and chips.
 49              // 
 50              //              The object classes below are listed in an order that
 51              //              avoids forward references. Required objects, defined
 52              //              by other working groups, are omitted.
 53              // ==================================================================
 54              // Change Log for 2.9Final
 55              // CR1263 - Add DDR2 enumeration to CIM and SMBIOS
 56              //
 57              // Change Log for v2.8 Preliminary
 58              // CR1005 - Deprecate several boolean properties in the physical model
 59              //          that overlap.  Create a new property to express their
 60              //          meaning.
 61              // CR1019 - CIM Versioning for 2.8 Preliminary
 62              // 
 63              // Change Log for v2.7
 64 a.dunfey 1.1 // CR623 - Fix the DMI mapping string to include the attribute number
 65              //         PhysicalMemory.FormFactor, .MemoryType, .TotalWidth,
 66              //         .DataWidth, .Speed, .Capacity, .BankLabel.
 67              // ==================================================================
 68              
 69              #pragma locale ("en_US")
 70              
 71              
 72              // ==================================================================
 73              // PhysicalComponent
 74              // ==================================================================
 75                 [Version ( "2.8.0" ), Description (
 76                     "The PhysicalComponent class represents any low-level or basic "
 77                     "Component within a Package. A Component object either can not "
 78                     "or does not need to be decomposed into its constituent parts. "
 79                     "For example, an ASIC (or Chip) can not be further decomposed. "
 80                     "A tape for data storage (PhysicalMedia) does not need to be "
 81                     "decomposed. Any PhysicalElement that is not a Link, Connector, "
 82                     "or Package is a descendent (or member) of this class. For "
 83                     "example, the UART chipset on an internal modem Card would be a "
 84                     "subclass (if additional properties or associations are "
 85 a.dunfey 1.1        "defined) or an instance of PhysicalComponent.")]
 86              class CIM_PhysicalComponent : CIM_PhysicalElement {
 87              
 88                    [Description (
 89                        "The RemovalCapabilites property is used to describe the "
 90                        "conditions under which a PhysicalPackage can be removed. "
 91                        "Since all PhysicalPackages are not removable, this property "
 92                        "defaults to 2, 'Not Applicable'."), 
 93                     ValueMap { "0", "2", "3", "4" }, 
 94                     Values { "Unknown", "Not Applicable", "Removable when off",
 95                        "Removable when on or off" }]
 96                 uint16 RemovalConditions = 2;
 97              
 98                    [Deprecated { "CIM_PhysicalComponent.RemovalConditions" }, 
 99                     Description (
100                        "The use of this property is being deprecated. Instead "
101                        "RemovalConditions should be used. The RemovalConditions "
102                        "property addresses whether a PhysicalComponent is removable "
103                        "with or without power being applied. \n"
104                        "\n"
105                        "A PhysicalComponent is Removable if it is designed to be "
106 a.dunfey 1.1           "taken in and out of the physical container in which it is "
107                        "normally found, without impairing the function of the "
108                        "overall packaging. A Component can still be Removable if "
109                        "power must be 'off' in order to perform the removal. If "
110                        "power can be 'on' and the Component removed, then the "
111                        "Element is both Removable and HotSwappable. For example, an "
112                        "upgradeable Processor chip is Removable.")]
113                 boolean Removable;
114              
115                    [Deprecated { "No Value" }, Description (
116                        "The use of this property is being deprecated because it is "
117                        "redundant with the FRU class and its associations. A "
118                        "PhysicalComponent is Replaceable if it is possible to "
119                        "replace (FRU or upgrade) the Element with a physically "
120                        "different one. For example, some ComputerSystems allow the "
121                        "main Processor chip to be upgraded to one of a higher clock "
122                        "rating. In this case, the Processor is said to be "
123                        "Replaceable. All Removable Components are inherently "
124                        "Replaceable.")]
125                 boolean Replaceable;
126              
127 a.dunfey 1.1       [Deprecated { "CIM_PhysicalComponent.RemovalConditions" }, 
128                     Description (
129                        "The use of this property is being deprecated. Instead "
130                        "RemovalConditions should be used. The RemovalConditions "
131                        "property addresses whether a PhysicalComponent is removable "
132                        "with or without power being applied. \n"
133                        "\n"
134                        "A PhysicalComponent is HotSwappable if it is possible to "
135                        "replace the Element with a physically different but "
136                        "equivalent one while the containing Package has power "
137                        "applied to it (ie, is 'on'). For example, a fan Component "
138                        "may be designed to be HotSwappable. All HotSwappable "
139                        "Components are inherently Removable and Replaceable.")]
140                 boolean HotSwappable;
141              };
142              
143              
144              // ==================================================================
145              // PackagedComponent
146              // ==================================================================
147                 [Association, Aggregation, Version ( "2.6.0" ), Description (
148 a.dunfey 1.1        "A Component is typically contained by a PhysicalPackage, such "
149                     "as a Chassis or Card. The PackagedComponent association makes "
150                     "this relationship explicit. In the first sentence, the word, "
151                     "'typically', is used. This is because a Component may be "
152                     "removed from, or not yet inserted into, its containing Package "
153                     "(ie, the Removable boolean is TRUE). Therefore, a Component "
154                     "may not always be associated with a container.")]
155              class CIM_PackagedComponent : CIM_Container {
156              
157                    [Aggregate, Override ( "GroupComponent" ), Max ( 1 ), 
158                     Description (
159                        "The PhysicalPackage that contains Component(s).")]
160                 CIM_PhysicalPackage REF GroupComponent;
161              
162                    [Override ( "PartComponent" ), Description (
163                        "The PhysicalComponent which is contained in the Package.")]
164                 CIM_PhysicalComponent REF PartComponent;
165              };
166              
167              
168              // ==================================================================
169 a.dunfey 1.1 // Chip
170              // ==================================================================
171                 [Version ( "2.6.0" ), Description (
172                     "The Chip class represents any type of integrated circuit "
173                     "hardware, including ASICs, processors, memory chips, etc.")]
174              class CIM_Chip : CIM_PhysicalComponent {
175              
176                    [Description (
177                        "The implementation form factor for the Chip. For example, "
178                        "values such as SIMM (7), TSOP (9) or PGA (10) can be "
179                        "specified."), 
180                     ValueMap { "0", "1", "2", "3", "4", "5", "6", "7", "8", "9",
181                        "10", "11", "12", "13", "14", "15", "16", "17", "18", "19",
182                        "20", "21", "22", "23" }, 
183                     Values { "Unknown", "Other", "SIP", "DIP", "ZIP", "SOJ",
184                        "Proprietary", "SIMM", "DIMM", "TSOP", 
185                        // 10               
186                        "PGA", "RIMM", "SODIMM", "SRIMM", "SMD", "SSMP", "QFP",
187                        "TQFP", "SOIC", "LCC", 
188                        // 20               
189                        "PLCC", "BGA", "FPBGA", "LGA" }]
190 a.dunfey 1.1    uint16 FormFactor;
191              };
192              
193              
194              // ==================================================================
195              // PhysicalMemory
196              // ==================================================================
197                 [Version ( "2.9.0" ), Description (
198                     "PhysicalMemory is a subclass of CIM_Chip, representing low "
199                     "level memory devices - SIMMS, DIMMs, raw memory chips, etc.")]
200              class CIM_PhysicalMemory : CIM_Chip {
201              
202                    [Override ( "FormFactor" ), 
203                     MappingStrings { "MIF.DMTF|Memory Device|005.6" }]
204                 uint16 FormFactor;
205              
206                    [Description (
207                        "The type of PhysicalMemory."), 
208                     ValueMap { "0", "1", "2", "3", "4", "5", "6", "7", "8", "9",
209                        "10", "11", "12", "13", "14", "15", "16", "17", "18", "19",
210                        "20", "21" }, 
211 a.dunfey 1.1        Values { "Unknown", "Other", "DRAM", "Synchronous DRAM",
212                        "Cache DRAM", "EDO", "EDRAM", "VRAM", "SRAM", "RAM", 
213                        //10 
214                        "ROM", "Flash", "EEPROM", "FEPROM", "EPROM", "CDRAM",
215                        "3DRAM", "SDRAM", "SGRAM", "RDRAM", 
216                        // 20               
217                        "DDR", "DDR2" }, 
218                     MappingStrings { "MIF.DMTF|Memory Device|005.9" }]
219                 uint16 MemoryType;
220              
221                    [Description (
222                        "Total width, in bits, of the PhysicalMemory, including "
223                        "check or error correction bits. If there are no error "
224                        "correction bits, the value in this property should match "
225                        "that specified for DataWidth."), 
226                     Units ( "Bits" ), 
227                     MappingStrings { "MIF.DMTF|Memory Device|005.7" }]
228                 uint16 TotalWidth;
229              
230                    [Description (
231                        "Data width of the PhysicalMemory, in bits. A data width of "
232 a.dunfey 1.1           "0 and a TotalWidth of 8 would indicate that the Memory is "
233                        "solely used to provide error correction bits."), 
234                     Units ( "Bits" ), 
235                     MappingStrings { "MIF.DMTF|Memory Device|005.8" }]
236                 uint16 DataWidth;
237              
238                    [Description (
239                        "The speed of the PhysicalMemory, in nanoseconds."), 
240                     Units ( "NanoSeconds" ), 
241                     MappingStrings { "MIF.DMTF|Memory Device|005.24" }]
242                 uint32 Speed;
243              
244                    [Description (
245                        "The total capacity of this PhysicalMemory, in bytes."), 
246                     Units ( "Bytes" ), 
247                     MappingStrings { "MIF.DMTF|Memory Device|005.5" }]
248                 uint64 Capacity;
249              
250                    [Description (
251                        "A string identifying the physically labeled bank where the "
252                        "Memory is located - for example, 'Bank 0' or 'Bank A'."), 
253 a.dunfey 1.1        MaxLen ( 64 ), 
254                     MappingStrings { "MIF.DMTF|Memory Device|005.4" }]
255                 string BankLabel;
256              
257                    [Description (
258                        "Specifies the position of the PhysicalMemory in a 'row'. "
259                        "For example, if it takes two 8-bit memory devices to form a "
260                        "16- bit row, then a value of '2'means that this Memory is "
261                        "the second device. 0 is an invalid value for this property."), 
262                     MappingStrings { "MIF.DMTF|Memory Device Mapped Addresses|001.6" 
263                        }]
264                 uint32 PositionInRow;
265              
266                    [Description (
267                        "The position of this PhysicalMemory in an interleave. 0 "
268                        "indicates non-interleaved. 1 indicates the first position, "
269                        "2 the second position and so on. For example, in a 2:1 "
270                        "interleave, a value of '1' would indicate that the Memory "
271                        "is in the 'even' position."), 
272                     MappingStrings { "MIF.DMTF|Memory Device Mapped Addresses|001.7" 
273                        }]
274 a.dunfey 1.1    uint32 InterleavePosition;
275              };
276              
277              
278              // ==================================================================
279              // MemoryOnCard
280              // ==================================================================
281                 [Association, Aggregation, Version ( "2.6.0" ), Description (
282                     "PhysicalMemory can be located on HostingBoards, adapter Cards, "
283                     "etc. This association explicitly defines this relationship of "
284                     "Memory to Cards.")]
285              class CIM_MemoryOnCard : CIM_PackagedComponent {
286              
287                    [Aggregate, Override ( "GroupComponent" ), Max ( 1 ), 
288                     Description (
289                        "The Card that includes or 'contains' Memory.")]
290                 CIM_Card REF GroupComponent;
291              
292                    [Override ( "PartComponent" ), Description (
293                        "The PhysicalMemory which is located on the Card.")]
294                 CIM_PhysicalMemory REF PartComponent;
295 a.dunfey 1.1 };
296              
297              
298              // ===================================================================
299              // end of file
300              // ===================================================================

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