// =================================================================== // Title: Physical Components 2.8 // Filename: Physical28_Component.mof // Version: 2.8 // Release: Preliminary // Date: 05/22/2003 // =================================================================== // Copyright 1998-2003 Distributed Management Task Force, Inc. (DMTF). // All rights reserved. // DMTF is a not-for-profit association of industry members dedicated // to promoting enterprise and systems management and interoperability. // DMTF specifications and documents may be reproduced for uses // consistent with this purpose by members and non-members, // provided that correct attribution is given. // As DMTF specifications may be revised from time to time, // the particular version and release date should always be noted. // // Implementation of certain elements of this standard or proposed // standard may be subject to third party patent rights, including // provisional patent rights (herein "patent rights"). DMTF makes // no representations to users of the standard as to the existence // of such rights, and is not responsible to recognize, disclose, or // identify any or all such third party patent right, owners or // claimants, nor for any incomplete or inaccurate identification or // disclosure of such rights, owners or claimants. DMTF shall have no // liability to any party, in any manner or circumstance, under any // legal theory whatsoever, for failure to recognize, disclose, or // identify any such third party patent rights, or for such party's // reliance on the standard or incorporation thereof in its product, // protocols or testing procedures. DMTF shall have no liability to // any party implementing such standard, whether such implementation // is foreseeable or not, nor to any patent owner or claimant, and shall // have no liability or responsibility for costs or losses incurred if // a standard is withdrawn or modified after publication, and shall be // indemnified and held harmless by any party implementing the // standard from any and all claims of infringement by a patent owner // for such implementations. // // For information about patents held by third-parties which have // notified the DMTF that, in their opinion, such patent may relate to // or impact implementations of DMTF standards, visit // http://www.dmtf.org/about/policies/disclosures.php. // =================================================================== // Description: The Physical Model defines modeling concepts related // to actual boxes and packaging. This file defines // the concepts related to components and chips. // // The object classes below are listed in an order that // avoids forward references. Required objects, defined // by other working groups, are omitted. // ================================================================== // Change Log for v2.8 Preliminary // CR1005 - Deprecate several boolean properties in the physical model // that overlap. Create a new property to express their // meaning. // CR1019 - CIM Versioning for 2.8 Preliminary // // Change Log for v2.7 // CR623 - Fix the DMI mapping string to include the attribute number // PhysicalMemory.FormFactor, .MemoryType, .TotalWidth, // .DataWidth, .Speed, .Capacity, .BankLabel. // ================================================================== #pragma locale ("en_US") // ================================================================== // PhysicalComponent // ================================================================== [Version ("2.7.1000"), Description ( "The PhysicalComponent class represents any low-level or basic " "Component within a Package. A Component object either can not " "or does not need to be decomposed into its constituent parts. " "For example, an ASIC (or Chip) can not be further decomposed. " "A tape for data storage (PhysicalMedia) does not need to be " "decomposed. Any PhysicalElement that is not a Link, " "Connector, or Package is a descendent (or member) of this " "class. For example, the UART chipset on an internal modem " "Card would be a subclass (if additional properties or " "associations are defined) or an instance of " "PhysicalComponent.") ] class CIM_PhysicalComponent : CIM_PhysicalElement { [Experimental, Description ( "The RemovalCapabilites property is used to describe the " "conditions under which a PhysicalPackage can be removed. " "Since all PhysicalPackages are not removable, this property " "defaults to 2, 'Not Applicable'."), ValueMap {"0", "2", "3", "4"}, Values {"Unknown", "Not Applicable", "Removable when off", "Removable when on or off"} ] uint16 RemovalConditions = 2; [Deprecated {"PhysicalComponent.RemovalConditions"}, Description ( "The use of this property is being deprecated. Instead " "RemovalConditions should be used. The RemovalConditions " "property addresses whether a PhysicalComponent is removable " "with or without power being applied.\n" "\n" "A PhysicalComponent is Removable if it is designed to be " "taken in and out of the physical container in which it is " "normally found, without impairing the function of the " "overall packaging. A Component can still be Removable if " "power must be 'off' in order to perform the removal. If " "power can be 'on' and the Component removed, then the " "Element is both Removable and HotSwappable. For example, " "an upgradeable Processor chip is Removable.") ] boolean Removable; [Deprecated {"No Value"}, Description ( "The use of this property is being deprecated because it is " "redundant with the FRU class and its associations. A " "PhysicalComponent is Replaceable if it is possible to " "replace (FRU or upgrade) the Element with a physically " "different one. For example, some ComputerSystems allow the " "main Processor chip to be upgraded to one of a higher clock " "rating. In this case, the Processor is said to be " "Replaceable. All Removable Components are inherently " "Replaceable.") ] boolean Replaceable; [Deprecated {" PhysicalComponent.RemovalConditions "}, Description ( "The use of this property is being deprecated. Instead " "RemovalConditions should be used. The RemovalConditions " "property addresses whether a PhysicalComponent is removable " "with or without power being applied.\n" "\n" "A PhysicalComponent is HotSwappable if it is possible to " "replace the Element with a physically different but " "equivalent one while the containing Package has power " "applied to it (ie, is 'on'). For example, a fan Component " "may be designed to be HotSwappable. All HotSwappable " "Components are inherently Removable and Replaceable.") ] boolean HotSwappable; }; // ================================================================== // PackagedComponent // ================================================================== [Association, Aggregation, Version ("2.6.0"), Description ( "A Component is typically contained by a PhysicalPackage, such " "as a Chassis or Card. The PackagedComponent association makes " "this relationship explicit. In the first sentence, the word, " "'typically', is used. This is because a Component may be " "removed from, or not yet inserted into, its containing Package " "(ie, the Removable boolean is TRUE). Therefore, a Component " "may not always be associated with a container.") ] class CIM_PackagedComponent : CIM_Container { [Aggregate, Override ("GroupComponent"), Max (1), Description ( "The PhysicalPackage that contains Component(s).") ] CIM_PhysicalPackage REF GroupComponent; [Override ("PartComponent"), Description ( "The PhysicalComponent which is contained in the Package.") ] CIM_PhysicalComponent REF PartComponent; }; // ================================================================== // Chip // ================================================================== [Version ("2.6.0"), Description ( "The Chip class represents any type of integrated circuit " "hardware, including ASICs, processors, memory chips, etc.") ] class CIM_Chip : CIM_PhysicalComponent { [Description ( "The implementation form factor for the Chip. For example, " "values such as SIMM (7), TSOP (9) or PGA (10) can be " "specified."), ValueMap {"0", "1", "2", "3", "4", "5", "6", "7", "8", "9", "10", "11", "12", "13", "14", "15", "16", "17", "18", "19", "20", "21", "22", "23"}, Values {"Unknown", "Other", "SIP", "DIP", "ZIP", "SOJ", "Proprietary", "SIMM", "DIMM", "TSOP", // 10 "PGA", "RIMM", "SODIMM", "SRIMM", "SMD", "SSMP", "QFP", "TQFP", "SOIC", "LCC", // 20 "PLCC", "BGA", "FPBGA", "LGA"} ] uint16 FormFactor; }; // ================================================================== // PhysicalMemory // ================================================================== [Version ("2.7.0"), Description ( "PhysicalMemory is a subclass of CIM_Chip, representing low " "level memory devices - SIMMS, DIMMs, raw memory chips, etc.") ] class CIM_PhysicalMemory : CIM_Chip { [Override ("FormFactor"), MappingStrings {"MIF.DMTF|Memory Device|005.6"} ] uint16 FormFactor; [Description ( "The type of PhysicalMemory."), ValueMap {"0", "1", "2", "3", "4", "5", "6", "7", "8", "9", "10", "11", "12", "13", "14", "15", "16", "17", "18", "19", "20"}, Values {"Unknown", "Other", "DRAM", "Synchronous DRAM", "Cache DRAM", "EDO", "EDRAM", "VRAM", "SRAM", "RAM", //10 "ROM", "Flash", "EEPROM", "FEPROM", "EPROM", "CDRAM", "3DRAM", "SDRAM", "SGRAM", "RDRAM", // 20 "DDR"}, MappingStrings {"MIF.DMTF|Memory Device|005.9"} ] uint16 MemoryType; [Description ( "Total width, in bits, of the PhysicalMemory, including " "check or error correction bits. If there are no error " "correction bits, the value in this property should match " "that specified for DataWidth."), Units ("Bits"), MappingStrings {"MIF.DMTF|Memory Device|005.7"} ] uint16 TotalWidth; [Description ( "Data width of the PhysicalMemory, in bits. A data width of " "0 and a TotalWidth of 8 would indicate that the Memory is " "solely used to provide error correction bits."), Units ("Bits"), MappingStrings {"MIF.DMTF|Memory Device|005.8"} ] uint16 DataWidth; [Description ( "The speed of the PhysicalMemory, in nanoseconds."), Units ("NanoSeconds"), MappingStrings {"MIF.DMTF|Memory Device|005.24"} ] uint32 Speed; [Description ( "The total capacity of this PhysicalMemory, in bytes."), Units ("Bytes"), MappingStrings {"MIF.DMTF|Memory Device|005.5"} ] uint64 Capacity; [Description ( "A string identifying the physically labeled bank where the " "Memory is located - for example, 'Bank 0' or 'Bank A'."), MaxLen (64), MappingStrings {"MIF.DMTF|Memory Device|005.4"} ] string BankLabel; [Description ( "Specifies the position of the PhysicalMemory in a 'row'. " "For example, if it takes two 8-bit memory devices to form a " "16- bit row, then a value of '2'means that this Memory is " "the second device. 0 is an invalid value for this " "property."), MappingStrings { "MIF.DMTF|Memory Device Mapped " "Addresses|001.6"} ] uint32 PositionInRow; [Description ( "The position of this PhysicalMemory in an interleave. 0 " "indicates non-interleaved. 1 indicates the first position, " "2 the second position and so on. For example, in a 2:1 " "interleave, a value of '1' would indicate that the Memory " "is in the 'even' position."), MappingStrings { "MIF.DMTF|Memory Device Mapped " "Addresses|001.7"} ] uint32 InterleavePosition; }; // ================================================================== // MemoryOnCard // ================================================================== [Association, Aggregation, Version ("2.6.0"), Description ( "PhysicalMemory can be located on HostingBoards, adapter Cards, " "etc. This association explicitly defines this relationship of " "Memory to Cards.") ] class CIM_MemoryOnCard : CIM_PackagedComponent { [Aggregate, Override ("GroupComponent"), Max (1), Description ( "The Card that includes or 'contains' Memory.") ] CIM_Card REF GroupComponent; [Override ("PartComponent"), Description ( "The PhysicalMemory which is located on the Card.") ] CIM_PhysicalMemory REF PartComponent; }; // =================================================================== // end of file // ===================================================================